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April,
15th,
2005, Santa Clara CA - I-Bus
announces the New Cooling Architecture in the I-Bus
Continuon™ family System Platforms. The FailSafe Hot-Swap Cooling
modules are
incorporated in all Continuon™ family products. Patents granted to
I-Bus
Corporation on "Fail Safe Cooling System” US Patent # 6,646,878.
The Fail
Safe
Cooling modules allow sufficient cooling in small form factor high
density
computing..
"This is
a significant solution and key technology for High Density computing
and with
the industry requirement on smaller form factor, the I-Bus patented
FailSafe
cooling modules are the solutions to high density and high-availability
computing.," says Johni
Chan, President and CEO at I-Bus.
About
I-Bus
Founded in
1982, I-Bus is a
leading provider of innovative high availability embedded computing
solutions,
a global supplier of open-standard architecture boards and systems for
communications, industrial, enterprise, and military applications.
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